| Project | Technical parameter | Special process |
|---|---|---|
| Layers | 1-18 | High Tg Fr4 |
| Warpage | Double side multi-layers d≤0.075% | High Tg Fr4 |
| Characteristic Impedance Error | ±10% | D≤0.05 |
| External Dimension Tolerance | ±0.1mm | ±5% |
| Surface Treatment Technology | Gold finger: ≥0.13μm Immersion Gold: 0.025-0.075μm OSP: 0.2~0.5μm Tin spray (HALI): 5~20μm Lead-free spray tin (LEADFREE HAL): 5~20μm Gold plating (Stride): 0.025-3.0μm | ±0.05mm |
| Minimum Line Width And Line Spacing | 0.075mm / 0.075mm | ≥1.0μm |
| Minimum Aperture | 0.2mm (10:1 aspect ratio) | |
| Substrate | FR-4, aluminum base, Aluminium | |
| Metallized Aperture Tolerance | D＞5.0 ±0.076mm 0.3D≤0.3 ±0.08mm | |
| Maximum Processing Size | 635*1120mm | |
| hole wall copper thickness | ≥20μm | |
| Plate Thickness | 0.2-3.2mm | |
| CNC type | Milling, punch, V-cut, bevel | |
| Surface Coating | Solder mask: black, green, white, red, thickness≥17μm, plug hole, BGA Text: Black, Yellow, Green, White, Font: Character height min. 0.625mm, line width min. 0.125mm Carbon film: black, thickness≥25μm, minimum line width 0.33mm, minimum line spacing 0.30mm Blue glue: red, blue, thickness≥300μm |
